Hanmi Semiconductor's Bold Move into HBM4 Production

Hanmi Semiconductor has confidently announced its ambition to secure all thermal compression bonder (TC bonder) orders for the upcoming 6th generation high bandwidth memory (HBM4), leveraging its advanced technological edge. The company also forecasts a potential doubling of this year's sales compared to the previous year.

Strategic Briefing Reveals Future Plans

During a recent briefing in Seoul, Kim Jung-young, CFO of Hanmi Semiconductor, highlighted the company's strategic focus on HBM4 production. "With HBM4 production on the horizon, we are poised to meet all TC bonder equipment demands," Kim stated, underscoring the company's readiness to support the next wave of AI memory technology.

TC Bonder: The Heart of HBM Production

Essential for stacking DRAM vertically, the TC bonder's importance grows with the increasing layers required for high-performance HBM. Hanmi's TC Bonder 4, now in mass production, is specially designed for HBM4, marking a significant leap in memory technology.

Global Leadership in HBM4 Equipment

As the industry anticipates the mass production of HBM4, Hanmi Semiconductor stands out as one of the few global players testing HBM4 equipment with potential clients, including major names like SK Hynix and possibly Samsung Electronics.

Expanding Market Reach and Innovations

With sales projections soaring to 1.1 trillion won, Hanmi is not only eyeing domestic growth but also strengthening ties with international clients like Micron. The introduction of fluxless TC bonders this year further cements Hanmi's position as a pioneer in the HBM equipment sector.